Driving the AI Revolution
Breakthrough 3nm process technology and revolutionary quantum packaging, delivering ultimate performance for next-generation AI chips.
Core Technology Advantages
3nm Process Technology
Adopting breakthrough GAA architecture to achieve higher density and lower power consumption, delivering exceptional performance improvements.
Quantum Packaging Technology
Innovative 3D stacking technology breaks traditional packaging limitations, achieving higher bandwidth and lower latency chip interconnection.
AI Acceleration Architecture
Unique neural network acceleration unit design, optimized for large-scale AI models, delivering ultimate computational efficiency.
Power Efficiency Optimization
Innovative dynamic power management technology, maintaining high performance while achieving industry-leading power efficiency ratio.
Global Computing Layout
Global Data Center Distribution
Covering 12 Countries, 25 Data Centers
Providing High-Performance Computing Support for Global Customers
Nano Universe Explorer
Microscopic Level Adjustment
7nm FinFET 结构
3nm FinFET 结构
Architecture Arena
RTL Code Analysis
module example_core ( input wire clk, input wire rst_n, input wire [31:0] instruction, output reg [31:0] result ); // RTL 代码示例 always @(posedge clk or negedge rst_n) begin if (!rst_n) result <= 32'h0; else result <= instruction + 32'h1; end endmodule
性能分析
Hall of Fame
Best Power Efficiency
Dr. James Wilson
MIT - AI Inference Engine
Smallest Die Size
Dr. Sarah Thompson
Stanford - Neural Network Accelerator
Highest Performance
Dr. Michael Chen
Berkeley - Matrix Computing Unit
Most Innovative
Dr. Emily Roberts
Caltech - Quantum Computing Core
About PowearLogic
Leading the Future of AI Computing
PowearLogic is a pioneering semiconductor company dedicated to revolutionizing AI chip technology. Founded by industry veterans from leading semiconductor companies, we bring together world-class expertise in chip design, artificial intelligence, and advanced manufacturing processes.
Growth & Innovation
Leading the industry with breakthrough technologies and continuous innovation in AI chip architecture and design methodology.
Global Team
Diverse team of experts from top semiconductor companies and research institutions worldwide, fostering a culture of innovation.
Strategic Partnerships
Collaborating with leading foundries, research institutions, and technology companies to advance semiconductor technology.
Start Your Chip Innovation Journey
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